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NTLJD3181PZ
Power MOSFET
? 20 V, ? 4.0 A, m Cool t Dual P ? Channel,
ESD, 2x2 mm WDFN Package
Features
? WDFN 2x2 mm Package with Exposed Drain Pads for Excellent
Thermal Conduction
? Lowest R DS(on) Solution in 2x2 mm Package
? Footprint Same as SC ? 88 Package
? Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
? ESD Protected
? This is a Pb ? Free Device
V (BR)DSS
? 20 V
http://onsemi.com
R DS(on) MAX I D MAX (Note 1)
100 m W @ ? 4.5 V
144 m W @ ? 2.5 V ? 4.0 A
200 m W @ ? 1.8 V
Applications
? Optimized for Battery and Load Management Applications in
Portable Equipment
? Li ? Ion Battery Charging and Protection Circuits
? High Side Load Switch
G1
D1
G2
D2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter Symbol
Value
Unit
S1
P ? CHANNEL MOSFET
S2
P ? CHANNEL MOSFET
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
? 20
± 8.0
V
V
D2
D1
MARKING
DIAGRAM
2 JEM G
5
G
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
I D
P D
? 3.2
? 2.3
? 4.0
1.5
2.3
A
W
Pin 1
WDFN6 1 6
CASE 506AN
3 4
JE = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
? 2.2
? 1.6
0.71
A
W
S1
1
PIN CONNECTIONS
D1
6
D1
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
I DM
T J , T STG
I S
? 16
? 55 to
150
? 1.0
A
° C
A
G1
D2
2
3
D2
5
4
G2
S2
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
(Top View)
ORDERING INFORMATION
Device Package Shipping ?
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm 2 , 2 oz Cu.
NTLJD3181PZTAG
NTLJD3181PZTBG
WDFN6
(Pb ? Free)
WDFN6
(Pb ? Free)
3000/Tape & Reel
3000/Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2008
December, 2008 ? Rev. 0
1
Publication Order Number:
NTLJD3181PZ/D
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